Capacitor component

ABSTRACT

A capacitor component includes a body including a plurality of dielectric layers and first and second internal electrodes, alternately disposed to face each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the body and connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion, in which capacitance is formed by including the first and second internal electrodes, cover portions disposed above and below the capacitance forming portion, respectively, and margin portions disposed on both side surfaces of the capacitance forming portion, respectively. At least one selected from the cover portions and the margin portions includes a plurality of graphene platelets.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2018-0151034 filed on Nov. 29, 2018 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a capacitor component.

2. Description of Related Art

A multilayer ceramic capacitor (MLCC) is a chip-type condenser commonlymounted on printed circuit boards of a variety of electronic productssuch as an image display devices, including liquid crystal displays(LCD) and plasma display panels (PDP), computers, smartphones, cellularphones, and the like, serving to charge and discharge electricity.

Such a multilayer ceramic capacitor (MLCC) may also be used as acomponent of various electronic devices, due to advantages thereof suchas compactness, guaranteed high capacitance, and ease of mountability.With the trend for miniaturization and high output of various electronicdevices such as a computer and a mobile device, and the like, there isan increasing need for miniaturization and high capacitance in amultilayer ceramic capacitor.

In addition, as an industrial interest in electrical components isincreasing recently, research into multilayer ceramic capacitors (MLCCs)has been conducted to optimize MLCCs for automobiles or infotainmentsystems. As compared to MLCCs for information technology (IT) devices,MLCCs for electrical components may be used in relatively harshenvironments having a high risk of human injury. Accordingly, there is aneed for MLCCs having high-reliability and high-strengthcharacteristics.

SUMMARY

An aspect of the present disclosure is to provide a capacitor componenthaving high-strength characteristics.

According to an aspect of the present disclosure, a capacitor componentincludes a body including a plurality of dielectric layers and first andsecond internal electrodes, alternately disposed to face each other withrespective dielectric layers interposed therebetween, the body havingfirst and second surfaces, disposed to oppose each other, third andfourth surfaces, connected to the first and second surfaces and disposedto oppose each other, and fifth and sixth surfaces connected to thefirst to fourth surfaces and disposed to oppose each other. Thecapacitor component further includes first and second externalelectrodes disposed on external surfaces of the body and connected tothe first and second internal electrodes, respectively. The bodyincludes a capacitance forming portion, in which capacitance is formedby including the first and second internal electrodes disposed to faceeach other with respective dielectric layers interposed therebetween,cover portions disposed above and below the capacitance forming portionin a stacking direction of the first and second internal electrodes, andmargin portions disposed on opposite sides of the capacitance formingportion. At least one selected from the cover portions and the marginportions includes a plurality of graphene platelets.

The capacitance forming portion may not include graphene.

The capacitance forming portion may have a lower graphene content thanthe at least one selected from the cover portions and the marginportions.

The at least one selected from the cover portion and the margin portionsmay include a plurality of dielectric grains and grain boundariesdisposed between adjacent dielectric grains, and the plurality ofgraphene platelets may be disposed in the grain boundaries.

The graphene platelets may have one surface disposed along surfaces ofthe plurality of dielectric grains.

Among the plurality of graphene platelets, 5 percent or less of thetotal graphene platelets may be in a laminated state with 10 or morelaminated layers of graphene.

The content of the plurality of graphene platelets in the at least oneselected from the cover portions and the margin portions may be 0.05weight percentage or more to less than 2.0 weight percentage, comparedwith barium titanate (BaTiO₃) contained in the at least one selectedfrom the cover portions and the margin portions.

The at least one selected from the cover portions and the marginportions may have peaks in a Raman analysis detected in each of a D-bandand a G-band.

The capacitance forming portion may have a peak in a Raman analysiswhich is detected in only one from among a D-band and a G-band.

Some of the plurality of graphene platelets may be a graphene oxide or areduced graphene oxide.

Each of the first and second internal electrodes may have a thicknessless than 1 micrometer, and each of the dielectric layers may have athickness less than 2.8 micrometers.

When a thickness of each of the internal electrodes is defined as te anda thickness of each of the dielectric layers is defined as td, te and tdsatisfy td>2*te.

Each of the first and second external electrodes may include anelectrode layer and a conductive resin layer disposed on the electrodelayer.

The electrode layer may include a glass and a conductive metal includingat least one selected from the group consisting of copper (Cu), silver(Ag), nickel (Ni), and alloys thereof.

The conductive resin layer may include a base resin and a conductivemetal including at least one selected from the group consisting ofcopper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

The first external electrode may be disposed on the third surface andincludes a band portion extending onto portions of the first and secondsurfaces. A distance from the third surface to an end of the bandportion of the electrode layer may be shorter than a distance from thethird surface to an end of the band portion of the conductive resinlayer.

According to an aspect of the present disclosure, a capacitor componentincludes a body including a plurality of dielectric layers and first andsecond internal electrodes, alternately disposed to face each other withrespective dielectric layers interposed therebetween, the body havingfirst and second surfaces, disposed to oppose each other, third andfourth surfaces, connected to the first and second surfaces and disposedto oppose each other, and fifth and sixth surfaces connected to thefirst to fourth surfaces and disposed to oppose each other, and firstand second external electrodes disposed on external surfaces of the bodyand connected to the first and second internal electrodes, respectively.The body includes a capacitance forming portion, in which capacitance isformed by including the first and second internal electrodes disposed toface each other with respective dielectric layers interposedtherebetween, cover portions disposed above and below the capacitanceforming portion in a stacking direction of the first and second internalelectrodes, and margin portions disposed on opposite sides of thecapacitance forming portion. At least one selected from the coverportions and the margin portions has peaks detected in each of a D-bandand a G-band in Raman analysis.

The capacitance forming portion may have a peak which is detected inonly one from among the D-band and the G-band in Raman analysis.

The at least one selected from the cover portions and the marginportions may include a plurality of dielectric grains and a grainboundary formed between adjacent dielectric grains and the grapheneboundary may have a peak detected in a Raman analysis in the D-band andthe G-band.

The D-band may be at 1300 cm⁻¹ to 1400 cm⁻¹, and the G-band may be at1500 cm⁻¹ to 1600 cm⁻¹.

The at least one selected from the cover portion and the margin portionsmay have a peak detected at 120 ppm to 140 ppm in a nuclear magneticresonance (NMR) spectroscopy analysis.

The at least one selected from the cover portions and the marginportions may include a plurality of graphene platelets, and some of theplurality of graphene platelets may be a graphene oxide or a reducedgraphene oxide.

Each of the first and second external electrodes may include anelectrode layer and a conductive resin layer disposed on the electrodelayer. The electrode layer may include a glass and a conductive metalincluding at least one selected from the group consisting of copper(Cu), silver (Ag), nickel (Ni), and alloys thereof. The conductive resinlayer may include a base resin and a conductive metal including at leastone selected from the group consisting of copper (Cu), silver (Ag),nickel (Ni), and alloys thereof.

According to an aspect of the present disclosure, a capacitor componentincludes a body including a dielectric, and pluralities of alternatelystacked first and second internal electrodes disposed in the body andhaving dielectric layers therebetween. At least a portion of the bodyincludes a plurality of graphene platelets, and a content of thegraphene platelets in portions of the body outside of the dielectriclayers disposed between the first and second internal electrodes ishigher than a content of the graphene platelets in the dielectric layersdisposed between the first and second internal electrodes.

The body may include an upper cover portion disposed above an uppermostinternal electrode of the stacked first and second internal electrodesin a stacking direction of the first and second internal electrodes, alower cover portion disposed below a lowermost internal electrode of thestacked first and second internal electrodes in the stacking direction,and side portions disposed between lateral edges of the first and secondinternal electrodes and side surfaces of the body. A content of thegraphene platelets in at least one of the upper cover portion, the lowercover portion, and the side portions may be higher than a content of thegraphene platelets in the dielectric layers disposed between the firstand second internal electrodes.

The dielectric layers disposed between the stacked first and secondinternal electrodes may be free of graphene platelets at positionsbetween the stacked first and second internal electrodes.

The content of graphene in portions of the body outside of thedielectric layers disposed between the first and second internalelectrodes may be 0.05 weight percentage (wt %) or more to less than 2.0wt % compared with barium titanate (BaTiO₃).

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view of a capacitor component according to anexemplary embodiment in the present disclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1;

FIG. 3 is a cross-sectional view taken along line II-II′ in FIG. 1;

FIG. 4A illustrates a ceramic green sheet on which a first internalelectrode is printed, and FIG. 4B illustrates a ceramic green sheet onwhich a second internal electrode is printed;

FIG. 5 is a partially enlarged view of a cover portion includinggraphene platelets;

FIG. 6 is an enlarged view of region P3 in FIG. 5;

FIG. 7 is a schematic diagram illustrating graphene platelets dispersedin grain boundaries;

FIG. 8 is a diagram illustratively showing a structural formula ofgraphene;

FIG. 9 is a graph illustrating Raman analysis results of agraphene-containing dielectric grain boundary (Exemplary Embodiments 1to 3) and a graphite-containing dielectric grain boundary (ComparativeEmbodiment 1);

FIG. 10 is graph illustrating a nuclear magnetic resonance spectroscopyanalysis result of a graphene-containing dielectric grain boundary;

FIG. 11 is an enlarged view of region P1 in FIG. 2; and

FIG. 12 is an enlarged view of region P2 in FIG. 2.

DETAILED DESCRIPTION

Hereinafter, embodiments in the present disclosure will be described indetail with reference to the accompanying drawings. The embodiments inthe present disclosure may, however, be modified in many differentforms, and accordingly, the scope of the present disclosure should notbe construed as being limited to the embodiments set forth herein.Rather, these embodiments are shown and described to provide a thoroughunderstanding to those skilled in the art. Accordingly, in the drawings,the shapes and dimensions of elements may be exaggerated for clarity,and the same reference numerals will be used throughout to designate thesame or like elements.

Further, in the drawings, irrelevant descriptions will be omitted toclearly describe the present disclosure, and to clearly express aplurality of layers and areas, thicknesses may be magnified. Elementshaving the same function within the scope of the same concept will bedescribed with use of the same reference numeral. Further, throughoutthe specification, it will be understood that when a part “includes” anelement, it may further include another element, not excluding anotherelement, unless otherwise indicated.

In the drawings, an X direction may be defined as a second direction, anL direction, or a length direction, a Y direction may be defined as athird direction, a W direction, or a width direction, and a Z directionmay be defined as a first direction, a lamination direction, a Tdirection, or a thickness direction.

Capacitor Component

FIG. 1 is a perspective view of a capacitor component according to anexemplary embodiment. FIG. 2 is a cross-sectional view taken along lineI-I′ in FIG. 1, and FIG. 3 is a cross-sectional view taken along lineII-II′ in FIG. 1. FIG. 4A illustrates a ceramic green sheet on which afirst internal electrode is printed, and FIG. 4B illustrates a ceramicgreen sheet on which a second internal electrode is printed.

Hereinafter, a capacitor component 100 according to an exemplaryembodiment will be described with reference to FIGS. 1 to 3, 4A, and 4B.

A capacitor component 100 according to an exemplary embodiment includesa body 110 and external electrodes 131 and 132. The body 110 includes aplurality of dielectric layers 111 and first and second internalelectrodes 121 and 122 alternately disposed to face each other withrespective dielectric layers 111 interposed therebetween, and has firstand second surfaces 1 and 2 disposed to oppose each other, third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and disposed to oppose each other, and fifth and sixth surfaces 5 and6 connected to the first to fourth surfaces 1 to 4 and disposed tooppose each other. The external electrodes 131 and 132 are disposed onexternal surfaces of the body 110, and are connected to the first andsecond internal electrodes 121 and 122, respectively. The body 110includes a capacitance forming portion A, in which capacitance is formedby including the first and second internal electrodes 121 and 122disposed to face and overlap each other with respective dielectriclayers 111 interposed therebetween, cover portions 112 and 113 formedabove and below the capacitance forming portion A, and margin portions114 and 115 formed on both side surfaces of the capacitance formingportion A. At least one selected from the cover portions 112 and 113 andthe margin portions 114 and 115 includes a plurality of grapheneplatelets.

The body 110 is formed in such a manner that the dielectric layers 111and the internal electrodes 121 and 122 are alternately laminated.

A detailed shape of the body 110 is not limited but, as illustrated inthe drawings, the body 110 may have a hexahedral shape or a shapesimilar thereto. Due to contraction of ceramic powder particles includedin the body 110 during a sintering procedure, the body 110 may have asubstantially hexahedral shape although the hexahedral shape need nothave complete straight lines/edges/sides.

The body 110 may have first and second surfaces 1 and 2, disposed tooppose each other in a thickness direction (a Z direction), third andfourth surfaces 3 and 4, connected to the first and second surfaces 1and 2 and disposed to oppose each other in a length direction (an Xdirection), and fifth and sixth surfaces 5 and 6 connected to the firstand second surfaces 1 and 2 as well as to the third and fourth surfaces3 and 4 and disposed to oppose each other in a width direction (a Ydirection).

The plurality of dielectric layers 111 constituting the ceramic body 110may be in a sintered state, and adjacent dielectric layers 111 may beintegrated with each other so that boundaries therebetween may not bereadily apparent without using a scanning electron microscope (SEM).

According to an exemplary embodiment, a material of the dielectric layer111 is not limited as long as sufficient capacitance is acquirable. Thematerial of the dielectric layer 111 may be, for example, a bariumtitanate-based material, a lead composite Perovskite-based material, ora strontium titanate-based material.

A material for forming the dielectric layer 111 may be formed by addingvarious ceramic additives, organic solvents, plasticizers, bondingagents, dispersants, or the like to powder particles such as bariumtitanate (BaTiO₃) according to the objective of the present disclosure.

The plurality of internal electrodes 121 and 122 are disposed to faceeach other with the dielectric layer 111 interposed therebetween.

The internal electrodes 121 and 122 may include first and secondinternal electrodes 121 and 122 alternately disposed to face and overlapeach other with a dielectric layer interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4 of the body 110, respectively.

Referring to FIG. 2, each internal electrode 121 is spaced apart fromthe fourth surface 4 and exposed through the third surface 3, and eachsecond internal electrode 122 may be spaced apart from the third surface3 and exposed through the fourth surface 4. A first external electrode131 may be disposed on the third surface 3 of the body 110 to beconnected to the first internal electrode(s) 121, and a second externalelectrode 132 may be exposed on the fourth surface 4 of the body 110 tobe connected to the second internal electrode(s) 122.

The first and second internal electrodes 121 and 122 may be electricallyinsulated from each other by the dielectric layer 111 interposedtherebetween. The body 110 may be formed by alternately laminating aceramic green sheet (see FIG. 4A), on which the first internal electrode121 is printed, and a ceramic green sheet (see FIG. 4B), on which thesecond internal electrode 122 is printed, in a thickness direction (a Zdirection) and sintering the laminated ceramic green sheets.

The conductive paste may be printed using a screen printing method, aGravure printing method, or the like, but a printing method is notlimited thereto.

The capacitor component 100 according to an exemplary embodimentincludes a capacitance forming portion A, disposed in the body 110, inwhich capacitance is formed by including the first internal electrode(s) 121 and the second internal electrode (s) 122 disposed to face andoverlap each other with the dielectric layer (s) 111 interposedtherebetween, cover portions 112 and 113, disposed above and below thecapacitance forming portion A, and margin portions 114 and 115 disposedon both side surfaces of the capacitance forming portion A.

The capacitance forming portion A is a portion contributing tocapacitance formation of a capacitor and may be formed by repeatedlylaminating a plurality of first and second internal electrodes 121 and122 with a dielectric layer 111 interposed between each pair of adjacentfirst and second internal electrodes 121 and 122.

The cover portions 112 and 113 include a top cover portion 112 and abottom cover portion 113. The top and bottom cover portions 112 and 113may be formed by vertically laminating a single dielectric layer or twoor more dielectric layers on top and bottom surfaces of the capacitanceforming portion A, respectively.

The margin portions 114 and 115 include a margin portion 114, disposedon or in contact with the sixth surface 6 of the body 110, and a marginportion 115 disposed on or in contact with the fifth surface 5 of thebody 110.

For example, the margin portions 114 and 115 may be disposed on bothside surfaces of the body 110 in the width direction.

The cover portions 112 and 113 and the margin portions 114 and 115 maybasically serve to prevent damage to internal electrodes, caused byphysical or chemical stress, and to maintain reliability of a capacitorcomponent against external impacts.

In the present disclosure, at least one selected from the cover portions112 and 113 and the margin portions 114 and 115 may include a pluralityof graphene platelets. Alternatively, only the margin portions 114 and115 may include a plurality of graphene platelets. Alternatively, boththe cover portions 112 and 113 and the margin portions 114 and 115 mayinclude a plurality of graphene platelets.

FIG. 8 is a diagram illustratively showing a structural formula ofgraphene.

Referring to FIG. 8, graphene 11 c is formed of carbon atoms and is inthe form of a thin film having a thickness of a single carbon atom. Forexample, the graphene 11 c has a two-dimensional plate-type structure.Graphene has a thickness of about 0.2 nanometer (nm) and is known tohave significantly high physical and chemical stability, a conductivitymore than 100 times greater than that of copper (Cu), and a mechanicalstrength more than 200 times greater than that of steel.

Accordingly, in the present disclosure, a plurality of grapheneplatelets may be contained in at least one selected from the coverportions 112 and 113 and the margin portions 114 and 115 to improvestrength. Moreover, flexural strength as well as mechanical rigidity maybe secured and the life of a capacitor component may be improved.

Although graphene is a material having various advantages, a solidcontent is advantageously decreased to ensure dispersibility as thegraphene content of a dielectric composite is increased when slurry formolding a ceramic green sheet molding is prepared. However, this mayresult in non-uniformity of the ceramic green sheet.

Additionally, when graphene is contained in a dielectric layer includedin the capacitance forming portion A, there may be some advantageouseffects such as improvement in the dielectric constant and the like.However, since it is difficult to control all graphene platelets to bedisposed in desired locations even when the dispersibility is ensured,humidity resistance reliability, a breakdown voltage, or the like may bedeteriorated.

In the present disclosure, a plurality of graphene platelets may becontained in at least one selected from the cover portions 112 and 113and the margin portions 114 and 115 without significantly changing acapacitor manufacturing method according to a related art. In this way,the strength of the body 110 may be improved and a composite of thecapacitance forming portion A may be maintained as it is. Thus, theamount of graphene used may be reduced to achieve improved technicalaccessibility and improved commercial accessibility.

As a result, according to the present disclosure, the capacitanceforming portion A may not include graphene. Alternatively, thecapacitance forming portion A may have a lower graphene content levelthan the cover portions 112 and 113 and the margin portions 114 and 115that contain graphene platelets.

Further, since a binder, an additive, or the like needs to be changed tocontrol the content and locations of graphene platelets contained in thedielectric layers included in the capacitance forming portion A, thereis difficulty in using an existing method as it is.

For example, rather than using polyvinyl butyral (PVB)-based binder thatis generally used in a dielectric composite, an acrylic binder includingan acrylic copolymer-graphene composite may be used to control thecontent and locations of graphene platelets contained in the dielectriclayer included in the capacitance forming portion A.

However, in an exemplary embodiment, no graphene is contained in thecapacitance forming portion A, while graphene is contained in at leastone selected from the cover portions 112 and 113 and the margin portions114 and 115. For this reason, a PVB-based binder may be used, and acapacitor component may be manufactured without significantly changing amethod according to a related art.

Hereinafter, a case in which a plurality of graphene platelets arecontained in the cover portions 112 and 113 will be described. However,the description may be equivalently applied to a case in which aplurality of graphene platelets are contained in the margin portions 114and 115. Moreover, the description may be equivalently applied to a casein which a plurality of graphene platelets are contained in both thecover portions 112 and 113 and the margin portions 114 and 115.

FIG. 5 is a partially enlarged view of the cover portions 112 and 113including graphene platelets, and FIG. 6 is an enlarged view of regionP3 in FIG. 5.

Referring to FIGS. 5 and 6, the cover portions 112 and 113 may include aplurality of dielectric crystal grains 11 a, a grain boundary 11 bformed between adjacent dielectric grains 11 a, and a plurality ofgraphene platelets 11 c uniformly distributed in grain boundaries 11 b.

FIG. 7 is a schematic diagram illustrating graphene platelets dispersedin grain boundaries. In FIG. 7, grain boundaries are omitted to clarifya distribution form in relation to the dielectric crystal grains 11 a,and the dielectric crystal grains 11 a are simply shown in a polyhedronto show the top and side surfaces of the polyhedron.

As illustrated in FIG. 7, one surface of the graphene 11 c may bedisposed along top surfaces and side surfaces of the dielectric grain 11a. For example, one surface of the graphene 11 c may be disposed alongthe surface of the dielectric grain 11 a.

Some of the plurality of graphene platelets may exist in a laminatedstate, but only 5 percent (%) or less of the total graphene plateletsmay be in the laminated state with 10 or more laminated layers ofgraphene. This is because when more than 5% of the total grapheneplatelets is in the laminated state with 10 or more laminated layers ofgraphene, there is a possibility that dispersibility of graphene isdeteriorated to cause a strength improving effect to be non-uniform.

A material for forming the cover portions 112 and 113 including aplurality of graphene platelets may be prepared by adding a plurality ofgraphene platelets to barium titanate (BaTiO₃) powder particles.According to objectives of the present disclosure, various ceramicadditives, plasticizers, binders, dispersing agent, and the like may beadded thereto.

On the other hand, the content of graphene may be set in considerationof target strength, a size of the capacitor component, and a laminationnumber, but is limited thereto.

However, the content of graphene contained in the cover portion is, indetail, 0.05 weight percentage (wt %) or more to less than 2.0 wt %,compared with barium titanate (BaTiO₃) contained in the cover portion.

When the content of graphene is less than 0.05 wt %, the strengthimproving effect may be insufficient. When the content of graphene ismore than 2.0 wt %, dispersibility of the graphene is deteriorated andviscosity of the graphene is increased during mixture of materials.Accordingly, it is difficult to uniformly distribute graphene platelets.

To uniformly disperse the graphene platelets, a surface of the graphenemay be modified such that an instability index of the graphene iscontrolled to be 0.1 or less. This is because graphene platelets shouldbe applied to slurry in an environment of ethanol-toluene mixed solvent,while they are uniformly dispersed, to obtain graphene plateletsuniformly dispersed on a grain boundary after they are sintered.

The instability index is a criterion for evaluating dispersibility, andmay be a value measured using a LUMiSizer Dispersion Analyzer.

The external electrodes 131 and 132 are disposed on external surfaces ofthe body 110 and are connected to the first and second internalelectrodes 121 and 122. Similarly to the shape shown in FIG. 2, theexternal electrodes 131 and 132 may include first and second externalelectrodes 131 and 132 connected to the first and second internalelectrodes 121 and 122, respectively.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122 toform capacitance, respectively. The second external electrode 132 may beconnected to a potential different from a potential connected to thefirst external electrode 131.

The external electrodes 131 and 132 may include electrode layers 131 aand 132 a and conductive resin layers 131 b and 132 b disposed on theelectrode layers 131 a and 132 a.

The conductive resin layers 131 b and 132 b may disperse stress toprevent destruction of a body having low ductility. Accordingly, asdescribed above, a plurality of graphene platelets are included in atleast one selected from the cover portions 112 and 113 and the marginportions 114 and 115 to improve strength, and the conductive resin layer131 b and 132 b are formed on the external electrodes 131 and 132 tosecure not only flexural strength but also mechanical rigidity and toimprove the life of the capacitor component.

When the rigidity of the body is increased and the conductive resinlayer is applied, reliability of the capacitor body may be furtherimproved.

The external electrodes 131 and 132 may include nickel (Ni) platinglayers 131 c and 132 c disposed on the conductive resin layers 131 b and132 b and tin (Sn) plating layers 131 d and 132 d disposed on the Niplating layers 131 c and 132 c.

In the case in which the external electrodes 131 and 132 include a firstexternal electrode 131 and a second external electrode 132, the firstexternal electrode 131 may include a first electrode layer 131 a, afirst conductive resin layer 131 b, a first Ni plating layer 131 c, anda first Sn plating layer 131 d, and the second external electrode 132may include a second electrode layer 132 a, a second conductive resinlayer 132 b, a second Ni plating layer 132 c, and a second Sn platinglayer 132 d.

The electrode layers 131 a and 132 a may include a conductive metal anda glass.

The conductive metal for use in the electrode layers 131 a and 132 a isnot limited as long as it may be electrically connected to the internalelectrodes 121, 122 to form capacitance. For example, the conductivemetal may be at least one selected from the group consisting of copper(Cu), silver (Ag), Nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste prepared by adding a glass frit to conductive metalpowder particles and sintering the conductive paste.

The conductive resin layers 131 b and 132 b are disposed on theelectrode layers 131 a and 132 a and may be formed to entirely cover theelectrode layers 131 a and 132 a.

The conductive resin layers 131 b and 132 b may include a conductivemetal and a base resin.

The base resin included in the conductive resin layers 131 b and 132 bis not limited as long as it has bonding and impact absorbing propertiesand may be mixed with the conductive metal powder particles to form apaste. For example, the base resin may include an epoxy-based resin.

The conductive metal included in the conductive resin layers 131 b and132 b is not limited as long as it may be electrically connected to theelectrode layers 131 a and 132 a. For example, the conductive metalincludes at least one selected from the group consisting of copper (Cu),silver (Ag), Nickel (Ni), and alloys thereof.

The Ni plating layers 131 c and 132 c may be disposed on the conductiveresin layers 131 b and 132 b and may be formed to entirely cover theconductive resin layers 131 b and 132 b.

The Sn plating layers 131 d and 132 d may be disposed on the Ni platinglayers 131 c and 132 c and may be formed to entirely cover the Niplating layers 131 c and 132 c.

The Sn plating layers 131 d and 132 d serve to improve mountingcharacteristics.

The first external electrode 131 may include a connection portion C,disposed on the third surface of the body, and a band portion Bextending from the connection portion C to portions of the first andsecond surfaces. Similarly, the second external electrode 132 mayinclude a connection portion C, disposed on a fourth surface of thebody, and a band portion B extending from the connection portion C toportions of the first and second surfaces.

In this case, the band portion B may extend to not only the portions ofthe first and second surfaces 1 and 2 but also extend to portions of thefifth and sixth surfaces 5 and 6 from the connection portion C.

Referring to FIG. 11, in the first external electrode 131, a distance l1from the third surface 3 of the body 110 to an end of the band portion Bof the first electrode layer 131 a may be shorter than a distance l2from the third surface 3 of the body 110 to an end of the band portion Bof the first conductive resin layer 131 b.

Similarly, in the second external electrode 132, a distance from thefourth surface 4 of the body 110 to an end of the band portion B of thesecond electrode layer 132 a may be shorter than a distance from thefourth surface 4 of the body 110 to an end of the band portion B of thesecond conductive resin layer 132 b.

Accordingly, the conductive resin layers 131 b and 132 b may be formedto entirely cover the electrode layers 131 a and 132 a, and flexuralstrength characteristics and bonding force between the externalelectrode and the body may be enhanced.

Referring to FIG. 12, in the capacitor component according to anexemplary embodiment, a thickness td of the dielectric layer 111 and athickness te of each of the internal electrodes 121 and 122 may satisfytd>2*te.

For example, according to an exemplary embodiment, the thickness td ofthe dielectric layer 111 is greater than twice the thickness te of eachof or either of the internal electrodes 121 and 122.

Generally, a significant issue of an electronic component for ahigh-voltage electrical component is reliability degradation caused by adecrease in breakdown voltage under a high voltage environment.

In the capacitor component according to an exemplary embodiment, thethickness td of the dielectric layer 111 is greater than twice thethickness te of each of the internal electrodes 121 and 122 to preventthe breakdown voltage from dropping under a high-voltage environment.Thus, a thickness of the dielectric layer 111, which is a distancebetween adjacent internal electrodes 121 and 122, may be increased toimprove dielectric breakdown voltage characteristics.

In the case in which the thickness td of the dielectric layer 111 isless than or equal to twice the thickness te of each of the internalelectrodes 121 and 122, the thickness of the dielectric layer 111 issmall, and thus, a dielectric breakdown voltage may be decreased.

Each of the internal electrodes may 121 and 122 may have a thickness of1 micrometer (μm) or less, and the dielectric layer 111 may have athickness td less than 2.8 μm, although the thicknesses thereof are notlimited thereto.

Hereinafter, a capacitor component according to another exemplaryembodiment will be described in detail. However, the same components asthose described above will be omitted to avoid duplicate description.

A capacitor component according to another exemplary embodiment includesa body including a plurality of dielectric layers and first and secondinternal electrodes, alternately disposed to face each other withrespective dielectric layers interposed therebetween, the body havingfirst and second surfaces, disposed to oppose each other, third andfourth surfaces, connected to the first and second surfaces and disposedto oppose each other, and fifth and sixth surfaces connected to thefirst to fourth surfaces and disposed to oppose each other, and firstand second external electrodes disposed on external surfaces of the bodyand connected to the first and second internal electrodes, respectively.The body includes a capacitance forming portion in which capacitance isformed by including the first and second internal electrodes disposed toface each other with respective dielectric layers interposedtherebetween, cover portions disposed above and below the capacitanceforming portion, respectively, and margin portions disposed on both sidesurfaces of the capacitance forming portion, respectively. At least oneselected from the cover portions and the margin portions has peaksdetected in each of a D-band and a G-band when Raman analysis isperformed.

Since graphene has a significantly small size, it may be difficult toclearly observe graphene even when using a transmission electronmicroscope (TEM) or the like, and it may be difficult to distinguishgraphene from other carbon isotopes such as graphite.

FIG. 9 is a graph illustrating results obtained by performing a Ramananalysis of a graphene-containing dielectric slurry (ExemplaryEmbodiments 1 to 3) and a graphite-containing dielectric slurry(Comparative Embodiment 1) after annealing the slurries to volatilizeorganic materials.

Referring to FIG. 9, the graphene-containing dielectric slurry has peaksdetected in each of a D-band and a G-band in the Raman analysis.

On the other hand, the graphite-containing dielectric slurry (‘graphite’being a carbon isotope of graphene) has a peak detected only in theG-band and not detected in the D-band.

Accordingly, presence or absence of the graphene may be determined andthe graphene may be distinguished from another carbon isomer using theRaman analysis method. The capacitor component according to anotherexemplary embodiment may know that graphene is contained in at least oneselected from the cover portions and the margin portions, as a peak isdetected in the D-band and the G-band in the Raman analysis of the coverportions and the margin portions.

In the Raman analysis, peaks may not be simultaneously detected in theD-band and G-band of the capacitance forming portion in analyses ofother portions of the capacitor component. For example, the capacitanceforming portion may not contain graphene.

The D-band can be detected at 1300 cm⁻¹ to 1400 cm⁻¹, and the G-band canbe detected at 1500 cm⁻¹ to 1600 cm⁻¹.

FIG. 10 is graph illustrating a nuclear magnetic resonance (NMR)spectroscopy analysis result of a graphene-containing dielectricmaterial.

In FIG. 10, an X-axis represents a chemical shift, and a Y-axisrepresents intensity. The intensity is detected differently depending ona functional group of carbon.

Referring to FIG. 10, since a pure C-bond has a peak detected at 120 ppmto 140 ppm, the presence of graphene may be confirmed as the peak isdetected at 120 ppm to 140 ppm.

Moreover, since some of a plurality of graphene platelets of the presentdisclosure may include an oxidized region, it may be confirmed that aweak peak is also detected in a region of 50 ppm to 80 ppm that is a C—Obond region.

For example, some of the plurality of graphene platelets of the presentinvention may be a graphene oxide (GO) or a reduced graphene oxide(RGO).

As described above, a capacitor component according to an exemplaryembodiment includes cover portions and margin portions. At least one ofthe cover portions and the margin portions include a plurality ofgraphene platelets to efficiently secure high strength. Moreover, notonly flexural strength but also mechanical rigidity may be secured, andthe life of the capacitor component may be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A capacitor component comprising: a bodyincluding a plurality of dielectric layers and first and second internalelectrodes, alternately disposed to face each other with respectivedielectric layers interposed therebetween, the body having first andsecond surfaces, disposed to oppose each other, third and fourthsurfaces, connected to the first and second surfaces and disposed tooppose each other, and fifth and sixth surfaces connected to the first,second, third, and fourth surfaces and disposed to oppose each other;and first and second external electrodes disposed on external surfacesof the body and connected to the first and second internal electrodes,respectively, wherein the body includes a capacitance forming portion,in which capacitance is formed by including the first and secondinternal electrodes disposed to face each other with respectivedielectric layers interposed therebetween, cover portions disposed aboveand below the capacitance forming portion in a stacking direction of thefirst and second internal electrodes, and margin portions disposed onopposite sides of the capacitance forming portion, and at least oneselected from the cover portions and the margin portions includes aplurality of graphene platelets.
 2. The capacitor component of claim 1,wherein the capacitance forming portion does not include graphene. 3.The capacitor component of claim 1, wherein the capacitance formingportion has a lower graphene content than the at least one selected fromthe cover portions and the margin portions.
 4. The capacitor componentof claim 1, wherein the at least one selected from the cover portionsand the margin portions includes a plurality of dielectric grains andgrain boundaries disposed between adjacent dielectric grains, and theplurality of graphene platelets are disposed in the grain boundaries. 5.The capacitor component of claim 4, wherein the graphene platelets haveone surface disposed along surfaces of the plurality of dielectricgrains.
 6. The capacitor component of claim 4, wherein among theplurality of graphene platelets, 5 percent or less of the total grapheneplatelets are in a laminated state with 10 or more laminated layers ofgraphene.
 7. The capacitor component of claim 1, wherein the content ofthe plurality of graphene platelets in the at least one selected fromthe cover portions and the margin portions is 0.05 weight percentage (wt%) or more to less than 2.0 wt %, compared with barium titanate (BaTiO₃)contained in the at least one selected from the cover portions and themargin portions.
 8. The capacitor component of claim 1, wherein the atleast one selected from the cover portions and the margin portions haspeaks in a Raman analysis detected in each of a D-band and a G-band. 9.The capacitor component of claim 1, wherein the capacitance formingportion has a peak in a Raman analysis which is detected in only onefrom among a D-band and a G-band.
 10. The capacitor component of claim1, wherein some of the plurality of graphene platelets are a grapheneoxide or a reduced graphene oxide.
 11. The capacitor component of claim1, wherein each of the first and second internal electrodes has athickness less than 1 micrometer, and each of the dielectric layers hasa thickness less than 2.8 micrometers.
 12. The capacitor component ofclaim 1, wherein when a thickness of each of the internal electrodes isdefined as te and a thickness of each of the dielectric layers isdefined as td, te and td satisfy td>2*te.
 13. The capacitor component ofclaim 1, wherein each of the first and second external electrodesincludes an electrode layer and a conductive resin layer disposed on theelectrode layer.
 14. The capacitor component of claim 13, wherein theelectrode layer includes a glass and a conductive metal including atleast one selected from the group consisting of copper (Cu), silver(Ag), nickel (Ni), and alloys thereof.
 15. The capacitor component ofclaim 13, wherein the conductive resin layer includes a base resin and aconductive metal including at least one selected from the groupconsisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.16. The capacitor component of claim 13, wherein the first externalelectrode is disposed on the third surface and includes a band portionextending onto portions of the first and second surfaces, and a distancefrom the third surface to an end of the band portion of the electrodelayer is shorter than a distance from the third surface to an end of theband portion of the conductive resin layer.
 17. A capacitor componentcomprising: a body including a plurality of dielectric layers and firstand second internal electrodes, alternately disposed to face each otherwith respective dielectric layers interposed therebetween, the bodyhaving first and second surfaces, disposed to oppose each other, thirdand fourth surfaces, connected to the first and second surfaces anddisposed to oppose each other, and fifth and sixth surfaces connected tothe first, second, third, and fourth surfaces and disposed to opposeeach other; and first and second external electrodes disposed onexternal surfaces of the body and connected to the first and secondinternal electrodes, respectively, wherein the body includes acapacitance forming portion, in which capacitance is formed by includingthe first and second internal electrodes disposed to face each otherwith respective dielectric layers interposed therebetween, coverportions disposed above and below the capacitance forming portion in astacking direction of the first and second internal electrodes, andmargin portions disposed on opposite sides of the capacitance formingportion, and at least one selected from the cover portions and themargin portions has peaks detected in each of a D-band and a G-band inRaman analysis.
 18. The capacitor component of claim 17, wherein thecapacitance forming portion has a peak which is detected in only onefrom among the D-band and the G-band in Raman analysis.
 19. Thecapacitor component of claim 17, wherein the at least one selected fromthe cover portions and the margin portions includes a plurality ofdielectric grains and a grain boundary formed between adjacentdielectric grains, and the grain boundary has a peak detected in a Ramananalysis in the D-band and the G-band.
 20. The capacitor component ofclaim 17, wherein the D-band is at 1300 cm⁻¹ to 1400 cm⁻¹, and theG-band is at 1500 cm⁻¹ to 1600 cm⁻¹.
 21. The capacitor component ofclaim 17, wherein the at least one selected from the cover portions andthe margin portions has a peak detected at 120 ppm to 140 ppm in anuclear magnetic resonance (NMR) spectroscopy analysis.
 22. Thecapacitor component of claim 17, wherein the at least one selected fromthe cover portions and the margin portions includes a plurality ofgraphene platelets, and some of the plurality of graphene platelets area graphene oxide or a reduced graphene oxide.
 23. The capacitorcomponent of claim 17, wherein each of the first and second externalelectrodes includes an electrode layer and a conductive resin layerdisposed on the electrode layer, the electrode layer includes a glassand a conductive metal including at least one selected from the groupconsisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof,and the conductive resin layer includes a base resin and a conductivemetal including at least one selected from the group consisting ofcopper (Cu), silver (Ag), nickel (Ni), and alloys thereof.
 24. Acapacitor component comprising: a body including a dielectric; andpluralities of alternately stacked first and second internal electrodesdisposed in the body and having dielectric layers therebetween, whereinat least a portion of the body includes a plurality of grapheneplatelets, and a content of the graphene platelets in portions of thebody outside of the dielectric layers disposed between the first andsecond internal electrodes is higher than a content of the grapheneplatelets in the dielectric layers disposed between the first and secondinternal electrodes.
 25. The capacitor component of claim 24, whereinthe body includes an upper cover portion disposed above an uppermostinternal electrode of the stacked first and second internal electrodesin a stacking direction of the first and second internal electrodes, alower cover portion disposed below a lowermost internal electrode of thestacked first and second internal electrodes in the stacking direction,and side portions disposed between lateral edges of the first and secondinternal electrodes and side surfaces of the body, and a content of thegraphene platelets in at least one of the upper cover portion, the lowercover portion, and the side portions is higher than a content of thegraphene platelets in the dielectric layers disposed between the firstand second internal electrodes.
 26. The capacitor component of claim 24,wherein the dielectric layers disposed between the stacked first andsecond internal electrodes are free of graphene platelets at positionsbetween the stacked first and second internal electrodes.
 27. Thecapacitor component of claim 24, wherein the content of graphene inportions of the body outside of the dielectric layers disposed betweenthe first and second internal electrodes is 0.05 weight percentage (wt%) or more to less than 2.0 wt % compared with barium titanate (BaTiO₃).